English 
Tel: +86-13732621090
Email:yewu001@yushengdz.com
4F, No.68, Huian Road, Xukou Town, Wuzhong District, Suzhou, Jiangsu, China, 215105
| Quantity: | |
|---|---|
During thermal processing, the adhesive layer liquefies and capillary action ensures complete inter-turn bonding, forming a void-free monolithic structure. This technology enables unprecedented design flexibility, allowing engineers to achieve higher switching frequencies (up to 3 MHz) and lower proximity effect losses. Tailored for mission-critical applications, these coils support the miniaturization trend in electronics while delivering EMI/RFI suppression capabilities exceeding CISPR 32 Class B requirements. From medical imaging devices to 5G infrastructure, they provide a future-proof solution for industries prioritizing energy efficiency and operational longevity.
Property | Value |
Conductor | 3UE Enamelled Litz Wire |
Insulated Wire Type | Telfon Insulated Litz Wire |
Insulated Wire Model | 0.05*1000 FLW-F(LZ)-XQ |
Appearance confirmation | The surface should be free of discoloration, damage, copper leakage, scratches, contamination, cracks, oxidation, black spots, foreign objects, etc. |
Color confirmation | Yellow |
Coil type | individual unit |
Number of loops | 3TS |
Inside diameter of coil | 16.2±0.2 |
Outside diameter of coil | MAX 29.5 |
Dual-Layer Insulation Architecture: Combines a 50–100 µm primary insulation with a 10–15 µm adhesive layer, achieving a total insulation resistance >10 GΩ·m at 500 VDC.
High-Frequency Optimization: Incorporates Litz wire with individually bonded strands to minimize AC resistance (Rac/Rdc ratio <1.2 at 1 MHz), ideal for resonant LLC converters and RF power amplifiers.
Creepage and Clearance Control: The self-bonding process automatically maintains precise 0.8–2.0 mm creepage distances between layers, complying with IEC 60664-1 insulation coordination standards.
Advanced Thermal Management: Embedded thermal interface materials (TIMs) optional for direct bonding to heatsinks, reducing hotspot temperatures by 25–40°C in GaN/SiC-based circuits.
Custom Winding Solutions: Supports automated production of multi-tapped coils, bifilar configurations, and gradient windings with ±1% tolerance on inductance values.
Cybersecurity-Ready Design: Non-conductive adhesive prevents electromagnetic side-channel leakage, meeting TÜV SÜD’s requirements for secure power supplies in data centers.
Lifecycle Durability: Accelerated aging tests confirm <2% parameter drift after 100,000 thermal cycles (-40°C to +150°C), backed by a 10-year performance warranty.
Medical Diagnostic Equipment: Essential in MRI gradient coils, PET scanner detectors, and proton therapy gantry power systems, ensuring sub-ppm measurement accuracy and patient safety.
Quantum Computing Hardware: Facilitates ultra-stable superconducting magnetic energy storage (SMES) coils operating at 4K temperatures with near-zero resistance.
Telecom Power Amplifiers: Deployed in macro-cell RRUs (Remote Radio Units) and mMIMO antennas to handle 64T64R configurations with <0.5 dB insertion loss at 28 GHz.
Industrial IoT Gateways: Enable edge-computing power modules with EN 61000-6-2 compliance for surge immunity (6 kV) and ESD protection (8 kV contact discharge).
Energy Efficiency: High conductivity of copper reduces energy loss, ensuring efficient operation.
Enhanced Safety: Superior insulation material prevents electrical faults, improving overall system safety.
Long-Term Performance: Engineered to withstand mechanical and environmental stress, these coils offer longevity and minimal maintenance.
During thermal processing, the adhesive layer liquefies and capillary action ensures complete inter-turn bonding, forming a void-free monolithic structure. This technology enables unprecedented design flexibility, allowing engineers to achieve higher switching frequencies (up to 3 MHz) and lower proximity effect losses. Tailored for mission-critical applications, these coils support the miniaturization trend in electronics while delivering EMI/RFI suppression capabilities exceeding CISPR 32 Class B requirements. From medical imaging devices to 5G infrastructure, they provide a future-proof solution for industries prioritizing energy efficiency and operational longevity.
Property | Value |
Conductor | 3UE Enamelled Litz Wire |
Insulated Wire Type | Telfon Insulated Litz Wire |
Insulated Wire Model | 0.05*1000 FLW-F(LZ)-XQ |
Appearance confirmation | The surface should be free of discoloration, damage, copper leakage, scratches, contamination, cracks, oxidation, black spots, foreign objects, etc. |
Color confirmation | Yellow |
Coil type | individual unit |
Number of loops | 3TS |
Inside diameter of coil | 16.2±0.2 |
Outside diameter of coil | MAX 29.5 |
Dual-Layer Insulation Architecture: Combines a 50–100 µm primary insulation with a 10–15 µm adhesive layer, achieving a total insulation resistance >10 GΩ·m at 500 VDC.
High-Frequency Optimization: Incorporates Litz wire with individually bonded strands to minimize AC resistance (Rac/Rdc ratio <1.2 at 1 MHz), ideal for resonant LLC converters and RF power amplifiers.
Creepage and Clearance Control: The self-bonding process automatically maintains precise 0.8–2.0 mm creepage distances between layers, complying with IEC 60664-1 insulation coordination standards.
Advanced Thermal Management: Embedded thermal interface materials (TIMs) optional for direct bonding to heatsinks, reducing hotspot temperatures by 25–40°C in GaN/SiC-based circuits.
Custom Winding Solutions: Supports automated production of multi-tapped coils, bifilar configurations, and gradient windings with ±1% tolerance on inductance values.
Cybersecurity-Ready Design: Non-conductive adhesive prevents electromagnetic side-channel leakage, meeting TÜV SÜD’s requirements for secure power supplies in data centers.
Lifecycle Durability: Accelerated aging tests confirm <2% parameter drift after 100,000 thermal cycles (-40°C to +150°C), backed by a 10-year performance warranty.
Medical Diagnostic Equipment: Essential in MRI gradient coils, PET scanner detectors, and proton therapy gantry power systems, ensuring sub-ppm measurement accuracy and patient safety.
Quantum Computing Hardware: Facilitates ultra-stable superconducting magnetic energy storage (SMES) coils operating at 4K temperatures with near-zero resistance.
Telecom Power Amplifiers: Deployed in macro-cell RRUs (Remote Radio Units) and mMIMO antennas to handle 64T64R configurations with <0.5 dB insertion loss at 28 GHz.
Industrial IoT Gateways: Enable edge-computing power modules with EN 61000-6-2 compliance for surge immunity (6 kV) and ESD protection (8 kV contact discharge).
Energy Efficiency: High conductivity of copper reduces energy loss, ensuring efficient operation.
Enhanced Safety: Superior insulation material prevents electrical faults, improving overall system safety.
Long-Term Performance: Engineered to withstand mechanical and environmental stress, these coils offer longevity and minimal maintenance.