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Email:yewu001@yushengdz.com
4F, No.68, Huian Road, Xukou Town, Wuzhong District, Suzhou, Jiangsu, China, 215105
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During thermal processing, the adhesive layer liquefies and capillary action ensures complete inter-turn bonding, forming a void-free monolithic structure. This technology enables unprecedented design flexibility, allowing engineers to achieve higher switching frequencies (up to 3 MHz) and lower proximity effect losses. Tailored for mission-critical applications, these coils support the miniaturization trend in electronics while delivering EMI/RFI suppression capabilities exceeding CISPR 32 Class B requirements. From medical imaging devices to 5G infrastructure, they provide a future-proof solution for industries prioritizing energy efficiency and operational longevity.
1. Dual-Layer Insulation Architecture: Combines a 50–100 µm primary insulation with a 10–15 µm adhesive layer, achieving a total insulation resistance >10 GΩ·m at 500 VDC.
2. High-Frequency Optimization: Incorporates Litz wire with individually bonded strands to minimize AC resistance (Rac/Rdc ratio <1.2 at 1 MHz), ideal for resonant LLC converters and RF power amplifiers.
3. Creepage and Clearance Control: The self-bonding process automatically maintains precise 0.8–2.0 mm creepage distances between layers, complying with IEC 60664-1 insulation coordination standards.
4. Advanced Thermal Management: Embedded thermal interface materials (TIMs) optional for direct bonding to heatsinks, reducing hotspot temperatures by 25–40°C in GaN/SiC-based circuits.
5. Custom Winding Solutions: Supports automated production of multi-tapped coils, bifilar configurations, and gradient windings with ±1% tolerance on inductance values.
6. Cybersecurity-Ready Design: Non-conductive adhesive prevents electromagnetic side-channel leakage, meeting TÜV SÜD’s requirements for secure power supplies in data centers.
7. Lifecycle Durability: Accelerated aging tests confirm <2% parameter drift after 100,000 thermal cycles (-40°C to +150°C), backed by a 10-year performance warranty.
1. Medical Diagnostic Equipment: Essential in MRI gradient coils, PET scanner detectors, and proton therapy gantry power systems, ensuring sub-ppm measurement accuracy and patient safety.
2. Quantum Computing Hardware: Facilitates ultra-stable superconducting magnetic energy storage (SMES) coils operating at 4K temperatures with near-zero resistance.
3. Telecom Power Amplifiers: Deployed in macro-cell RRUs (Remote Radio Units) and mMIMO antennas to handle 64T64R configurations with <0.5 dB insertion loss at 28 GHz.
4. Industrial IoT Gateways: Enable edge-computing power modules with EN 61000-6-2 compliance for surge immunity (6 kV) and ESD protection (8 kV contact discharge).
5. Avionics and Satellites: Radiation-hardened versions used in fly-by-wire actuators and satellite deployable solar array drivers, achieving 150 kGy TID radiation tolerance.
6. Renewable Energy Storage: Key component in solid-state transformer (SST) windings for 1500 VDC solar farms, featuring partial discharge inception voltage (PDIV) >2.5× operating voltage.
7. Consumer AR/VR Systems: Miniature coils power eye-tracking servos and haptic feedback modules, enabling <1 ms latency in metaverse interaction devices.
Energy Efficiency: High conductivity of copper reduces energy loss, ensuring efficient operation.
Enhanced Safety: Superior insulation material prevents electrical faults, improving overall system safety.
Long-Term Performance: Engineered to withstand mechanical and environmental stress, these coils offer longevity and minimal maintenance.
Conductor: 3UE Enamelled Litz Wire
Insulated Wire Type: Telfon Insulated Litz Wire
Insulated Wire Model: 0.05*1000 FLW-F(LZ)-XQ
Appearance confirmation: The surface should be free of discoloration, damage, copper leakage, scratches, contamination, cracks, oxidation, black spots, foreign objects, etc.
Color confirmation: Yellow
Coil type: individual unit
Number of loops: 3TS
Inside diameter of coil: 16.2±0.2
Outside diameter of coil: MAX 29.5
During thermal processing, the adhesive layer liquefies and capillary action ensures complete inter-turn bonding, forming a void-free monolithic structure. This technology enables unprecedented design flexibility, allowing engineers to achieve higher switching frequencies (up to 3 MHz) and lower proximity effect losses. Tailored for mission-critical applications, these coils support the miniaturization trend in electronics while delivering EMI/RFI suppression capabilities exceeding CISPR 32 Class B requirements. From medical imaging devices to 5G infrastructure, they provide a future-proof solution for industries prioritizing energy efficiency and operational longevity.
1. Dual-Layer Insulation Architecture: Combines a 50–100 µm primary insulation with a 10–15 µm adhesive layer, achieving a total insulation resistance >10 GΩ·m at 500 VDC.
2. High-Frequency Optimization: Incorporates Litz wire with individually bonded strands to minimize AC resistance (Rac/Rdc ratio <1.2 at 1 MHz), ideal for resonant LLC converters and RF power amplifiers.
3. Creepage and Clearance Control: The self-bonding process automatically maintains precise 0.8–2.0 mm creepage distances between layers, complying with IEC 60664-1 insulation coordination standards.
4. Advanced Thermal Management: Embedded thermal interface materials (TIMs) optional for direct bonding to heatsinks, reducing hotspot temperatures by 25–40°C in GaN/SiC-based circuits.
5. Custom Winding Solutions: Supports automated production of multi-tapped coils, bifilar configurations, and gradient windings with ±1% tolerance on inductance values.
6. Cybersecurity-Ready Design: Non-conductive adhesive prevents electromagnetic side-channel leakage, meeting TÜV SÜD’s requirements for secure power supplies in data centers.
7. Lifecycle Durability: Accelerated aging tests confirm <2% parameter drift after 100,000 thermal cycles (-40°C to +150°C), backed by a 10-year performance warranty.
1. Medical Diagnostic Equipment: Essential in MRI gradient coils, PET scanner detectors, and proton therapy gantry power systems, ensuring sub-ppm measurement accuracy and patient safety.
2. Quantum Computing Hardware: Facilitates ultra-stable superconducting magnetic energy storage (SMES) coils operating at 4K temperatures with near-zero resistance.
3. Telecom Power Amplifiers: Deployed in macro-cell RRUs (Remote Radio Units) and mMIMO antennas to handle 64T64R configurations with <0.5 dB insertion loss at 28 GHz.
4. Industrial IoT Gateways: Enable edge-computing power modules with EN 61000-6-2 compliance for surge immunity (6 kV) and ESD protection (8 kV contact discharge).
5. Avionics and Satellites: Radiation-hardened versions used in fly-by-wire actuators and satellite deployable solar array drivers, achieving 150 kGy TID radiation tolerance.
6. Renewable Energy Storage: Key component in solid-state transformer (SST) windings for 1500 VDC solar farms, featuring partial discharge inception voltage (PDIV) >2.5× operating voltage.
7. Consumer AR/VR Systems: Miniature coils power eye-tracking servos and haptic feedback modules, enabling <1 ms latency in metaverse interaction devices.
Energy Efficiency: High conductivity of copper reduces energy loss, ensuring efficient operation.
Enhanced Safety: Superior insulation material prevents electrical faults, improving overall system safety.
Long-Term Performance: Engineered to withstand mechanical and environmental stress, these coils offer longevity and minimal maintenance.
Conductor: 3UE Enamelled Litz Wire
Insulated Wire Type: Telfon Insulated Litz Wire
Insulated Wire Model: 0.05*1000 FLW-F(LZ)-XQ
Appearance confirmation: The surface should be free of discoloration, damage, copper leakage, scratches, contamination, cracks, oxidation, black spots, foreign objects, etc.
Color confirmation: Yellow
Coil type: individual unit
Number of loops: 3TS
Inside diameter of coil: 16.2±0.2
Outside diameter of coil: MAX 29.5